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Adhesion Investigation Between Metal and Benzocyclobutene (BCB) Polymer Dielectric Materials in 3-D Integration Applications

TitleAdhesion Investigation Between Metal and Benzocyclobutene (BCB) Polymer Dielectric Materials in 3-D Integration Applications
Publication TypeJournal Article
Year of Publication2014
AuthorsShih, J-Y, Huang, W-C, Ko, C-T, Yang, Z, Hu, S-H, Leu, J, Chou, KC, Chen, K-N
JournalIeee Transactions on Device and Materials Reliability
Volume14
Pagination914-920